U.S. Import and Export Data Electrical machinery and equipment and parts thereof; sound recorders and reproducers, television image and sound recorders and reproducers, and parts and accessories of such articles HS Chapter 85

• (a) Electrically warmed blankets, bed pads, foot-muffs or the like; electrically warmed clothing, footwear or ear pads or other electrically warmed articles worn on or about the person;
• (b) Articles of glass of heading 7011;
• (c) Machines and apparatus of heading 8486;
• (d) Vacuum apparatus of a kind used in medical, surgical, dental or veterinary sciences (heading 9018); or
• (e) Electrically heated furniture of chapter 94.

• (a) Floor polishers, food grinders and mixers, and fruit or vegetable juice extractors, of any weight;
• (b) Other machines provided the weight of such machines does not exceed 20 kg, exclusive of extra interchangeable parts or detachable auxiliary devices.

• (a) "Solid-state non-volatile storage devices "(for example,"flash memory cards" or "flash electronic storage cards") are storage devices with a connecting socket, comprising in the same housing one or more flash memories (for example, "FLASH E²PROM") in the form of integrated circuits mounted on a printed circuit board. They may include a controller in the form of an integrated circuit and discrete passive components, such as capacitors and resistors;
• (b) The term "smart cards" means cards which have embedded in them one or more electronic integrated circuits (a microprocessor, random access memory (RAM) or read-only memory (ROM)) in the form of chips. These cards may contain contacts, a magnetic stripe or an embedded antenna but do not contain any other active or passive circuit elements.

• (a) "Diodes, transistors and similar semiconductor devices" are semiconductor devices the operation of which depends on variations in resistivity on the application of an electric field;
• (b) "Electronic integrated circuits" are:
  • (i) Monolithic integrated circuits in which the circuit elements (diodes, transistors, resistors, capacitors, inductances, etc.) are created in the mass (essentially) and on the surface of a semiconductor or compound semiconductor material (for example, doped silicon, gallium arsenide, silicon germanium, iridium phosphide) and are inseparably associated;
  • (ii) Hybrid integrated circuits in which passive elements (resistors, capacitors, inductances, etc.), obtained by thin- or thick-film technology, and active elements (diodes, transistors, monolithic integrated circuits, etc.), obtained by semiconductor technology, are combined to all intents and purposes indivisibly, by interconnections or interconnecting cables, on a single insulating substrate (glass, ceramic, etc.). These circuits may also include discrete components;
  • (iii) Multichip integrated circuits consisting of two or more interconnected monolithic integrated circuits combined to all intents and purposes indivisibly, whether or not on one or more insulating substrates, with or without leadframes, but with no other active or passive circuit elements.
  • (iv) Multi-component integrated circuits (MCOs): a combination of one or more monolithic, hybrid, or multi-chip integrated circuits with at least one of the following components: silicon-based sensors, actuators, oscillators, resonators or combinations thereof, or components performing the functions of articles classifiable under heading 8532, 8533, 8541, or inductors classifiable under heading 8504, formed to all intents and purposes indivisibly into a single body like an integrated circuit, as a component of a kind used for assembly onto a printed circuit board (PCB) or other carrier, through the connecting of pins, leads, balls, lands, bumps, or pads.
    For the purpose of this definition:

    • 1. “Components” may be discrete, manufactured independently then assembled onto the rest of the MCO, or integrated into other components.
    • 2. “Silicon-based” means built on a silicon substrate, or made of silicon materials, or manufactured onto integrated circuit die.
    • 3. (a) “Silicon-based sensors” consist of microelectronic or mechanical structures that are created in the mass or on the surface of a semiconductor and that have the function of detecting physical or chemical quantities and transducing these into electric signals, caused by resulting variations in electric properties or displacement of a mechanical structure. “Physical or chemical quantities” relates to real world phenomena, such as pressure, acoustic waves, acceleration, vibration, movement, orientation, strain, magnetic field strength, electric field strength, light, radioactivity, humidity, flow, chemicals concentration, etc.
      (b) “Silicon-based actuators” consist of microelectronic and mechanical structures that are created in the mass or on the surface of a semiconductor and that have the function of converting electrical signals into physical movement.
      (c) “Silicon-based resonators” are components that consist of microelectronic or mechanical structures that are created in the mass or on the surface of a semiconductor and have the function of generating a mechanical or electrical oscillation of a predefined frequency that depends on the physical geometry of these structures in response to an external input.
      (d) “Silicon-based oscillators” are active components that consist of microelectronic or mechanical structures that are created in the mass or on the surface of a semiconductor and that have the function of generating a mechanical or electrical oscillation of a predefined frequency that depends on the physical geometry of these structures.

• (a) Each subassembly that contains as a component, or is covered in the same entry with, one or more of the following television components, viz.,
  tuner, channel selector assembly, antenna, deflection yoke, degaussing coil, picture tube mounting bracket, grounding assembly, parts necessary for fixing the picture tube or tuner in place, consumer-operated controls or speaker,
  shall be classified in subheading 8529.90.05, 8529.90.33, 8529.90.43 or 8529.90.88, as appropriate; and
• (b) Each subassembly shall be counted as a single unit, except that two or more different printed circuit boards or ceramic substrates covered by the same entry and designed for assembly into the same television models shall be counted as one unit.

• (a) incorporated into complete television receivers, as defined in additional U.S. note 6 below;
• (b) incorporated into fully assembled units such as word processors, ADP terminals, or similar articles;
• (c) put up in kits containing all the parts necessary for assembly into complete television receivers, as defined in additional U.S. note 6 below; or
• (d) put up in kits containing all the parts necessary for assembly into fully assembled units such as word processors, ADP terminals, or similar articles.

• (a) a screen aspect ratio equal to or greater than 16:9; and
• (b) a viewing screen capable of displaying more than 700 scanning lines.

• (a) Video intermediate (IF) amplifying and detecting systems;
• (b) Video processing and amplification systems;
• (c) Synchronizing and deflection circuitry;
• (d) Tuners and tuner control systems; and
• (e) Audio detection and amplification systems.

• (a) with respect to a color cathode-ray television picture tube, an assembly which consists of a glass panel and a shadow mask or aperture grille, attached for ultimate use, which is suitable for incorporation into a color cathode-ray television picture tube (including video monitor cathode-ray tube), and which has undergone the necessary chemical and physical processes for imprinting phosphors on the glass panel with sufficient precision to render a video image when excited by a stream of electrons; or
• (b) with respect to a monochrome cathode-ray picture tube, an assembly which consists of either a glass panel or a glass envelope, which is suitable for incorporation into a monochrome cathode-ray television picture tube (including video monitor or video projector cathode-rate tube), and which has undergone the necessary chemical and physical processes for imprinting phosphors on the glass panel or glass envelope with sufficient precision to render a video image when excited by a stream of electrons.

• (a) The term "static read-write random access (SRAM)" refers to integrated circuit memory devices in which the memory cells may be addressed in any sequence, randomly, for the storage or retrieval of data and in which in which the stored information is retained without further intervention as long as electric power is supplied to the device.
• (b) The term "volatile memory" refers to integrated circuit memory devices which lose all stored information in the absence of electric power.
• (c) The term "dynamic read-write random access (DRAM)" refers to integrated circuit memory devices in which the memory cells may be addressed in any sequence, randomly, for the storage or retrieval of data and in which the stored information must continually be refreshed in order to hold the information in memory.
• (d) The term "electrically erasable programmable read-only memory (EEPROM)" refers to user programmable integrated circuit memory devices which retain the stored information in the absence of electric power and in which the stored information may be altered electrically.
• (e) The term "erasable (except electrically) programmable read-only memory (EPROM)" refers to user programmable integrated circuit memory devices which retain the stored information in the absence of electric power and from which the stored information may be removed (except electrically). Such devices are usually erased by exposure to ultraviolet light after which they may be rewritten with new information.
• (f) The term "microprocessor" refers to a central processing unit (CPU) fabricated as a monolithic integrated circuit.
• (g) The term "kilobit" refers to 1,024 bits of data storage capacity, the term "megabit" refers to 1,024 kilobits of data storage capacity, and the term "gigabit" refers to 1,024 megabits of data storage capacity.

For the purposes of statistical reporting numbers 8543.70.9930, 8543.70.9940, 8543.90.8850, and 8543.90.8860, the term "personal electric or electronic vaporizing devices" are devices that electrically heat or atomize liquids or other substances, whether or not containing nicotine, producing a vapor to be inhaled through the mouthpiece. These devices are commonly known as electronic cigarettes, "e-cigarettes", "e-hookahs", "e-pipes", vaporizers or "vaping" systems." A unit consists of all the parts necessary to vaporize, either assembled or in a kit or set, including battery, tank, and atomizer.

• (a) ANSI shapes A, BT, P, PS or T described under 8539.50.0010;
• (b) ANSI shapes B, BA, C, CA, DC, F, G or ST described under 8539.50.0020;
• (c) ANSI shapes R, BR or PAR described under 8539.50.0030; or
• (d) ANSI shapes MR11, MR16 or MRX16 described under 8539.50.0040.